ME6
Fieldbus and Wireless WLAN, LTE, MVB/CAN & Audio Module for Embedded Computer System
Hauptmerkmale
- LTE via PCIe Mini Card
- 2 micro-SIM card slots
- WLAN via PCIe Mini Card
- MVB, CAN bus or audio via PCIe Mini Card
- Conduction cooling of PCIe Mini Cards
- DIN rail, wall or 19" rack mounting
- -40 °C to +70 °C (+85 °C), fanless
Extension for Various Applications
The ME6 is a modular extension for embedded applications in transportation, e.g., in trains or wayside. The module adds wireless connectivity and fieldbus and audio functionality to the system CPU. Main applications of the module include predictive maintenance, IoT gateway, diagnostics server, smart vehicle, passenger information and ticketing systems.
Wireless Connectivity and Fieldbus Options
The ME6 comes with one PCI Express Mini Card slot for LTE modems supported by two front-accessible micro-SIM card slots. A second PCI Express Mini Card slot can be used for a WLAN modem. The third PCI Express Mini Card slot is prepared for an additional MVB, CAN bus or audio module. The functions can be made available on up to two D-Sub connectors at the front panel.
Modular System for Easy Configuration
Due to duagon's modular concept, the ME6 offers flexibility in built-to-order configurations. Via its extension connectors, the box can be easily combined with pre-fabricated CPU modules or other extension modules, for example a PSU or removable storage shuttles, providing additional features and short delivery times.
In the modular system, the data transfer between the modules as well as the power distribution between the individual components takes place via the extension connectors standardized by duagon. The aluminum housing with cooling fins allows fanless operation. The ME6 has no moving parts, making it maintenance free.
Rolling Stock Qualified and Long-Term Availability
The wireless and fieldbus module is qualified for rolling stock and wayside applications. Long-term availability ensures an extended product life and future-safety.
Zugehörige Produkte
- LTE
- WLAN
- CAN bus
- MVB
- Line-level input
- Line-level output
- This product includes interface options
- Different wireless functions depending on assembled wireless interface cards
- Wireless
- LTE (Main) antenna connector: 1 × Cutout
- LTE (Div) antenna connector: 1 × Cutout
- WLAN 1 antenna connector: 1 × Cutout
- WLAN 2 antenna connector: 1 × Cutout
- PCI Express Mini Card
- 3 × PCI Express Mini Card slot
- Slot 1: PCIe Full-Mini; PCIe x1, USB 2.0
- Slot 2: PCIe Full-Mini; PCIe x1, USB 2.0
- Slot 3: PCIe Full-Mini; PCIe x1, USB 2.0
- SIM card
- 2 × micro-SIM slot, externally accessible
- LED
- User configurable: 3 ×
- Status: power status
- Cutout
- Antenna connector options: QLS receptacle, RP-SMA receptacle, SMA receptacle
- D-Sub options: audio, CAN bus, MVB
- Dimensions: (W) 38 mm, (D) 144 mm, (H) 132 mm
- Weight: 453 g approx.
- Mounting
- DIN rail
- Wall/flat surface
- Rack in 19" cabinet
- Cooling: Air cooling, natural convection, airflow 0.4 m/s
- Protection rating: IP20
- Operating temperature: -40 °C to +70 °C, +85 °C for 10 min (EN 50155:2017, class OT4, ST1)
- Equipment location: EN 50155:2017, location 2, cabin and interiors
- Rapid temperature variations: EN 50155:2017, class H1, no requirements
- Storage temperature: -40 °C (EN 50155:2017) to +85 °C (EN 60068-2-2, Bb)
- Altitude: +3000 m max. (EN 50125-1:2014, class AX)
- Pollution degree: EN 50124-1:2017, class PD3
- Humidity: +55 °C and +25 °C, 100 % RH max. (EN 50155:2017)
- Shock: 30 ms @ 50 m/s² (EN 61373:2010/AC:2017-09, vehicle body, cat. 1, class B)
- Vibration: 10 min @ 2.02 m/s² (functional) and 5 h @ 11.44 m/s² (long-life) (EN 61373:2010/AC:2017-09, vehicle body, cat. 1, class B, double acceleration)
- Electrical safety
- EN 50124-1:2017
- EN 50153:2014 + A1:2017
- EN 50155:2017
- EN ISO 13732-1:2008
- Fire protection: EN 45545-2:2013 + A1:2015, HL3
- EMC emission
- EN 50121-3-2:2016 + A1:2019
- Regelung Nr. EMV 06 :2019-05-09 (2.0), Anhang E: Messung an Geräten
- EMC immunity: EN 50121-3-2:2016 + A1:2019
- Protective coatings: EN 50155:2017, class PC2 (Any PCB protected on both sides)
- Useful life: 20 years (EN 50155:2017, class L4)
- Operating temperature: -40 °C to +70 °C (EN 50125-3:2003, class T2, cubicle, with class T2 maximum extended by 5 °C)
- Storage temperature: -40 °C (EN 60068-2-1:2007, Ab) to +85 °C (EN 60068-2-2:2007, Bb)
- Altitude: +3000 m max. (EN 50125-3:2003, class AX)
- Humidity: 100 % RH max. (EN 50125-2:2002, control cabinet, class T1/T2/TX)
- Shock: 11 ms @ 20 m/s² (EN 50125-3:2003, in a switch cabinet 1 m to 3 m from the track)
- Vibration: 2.3 m/s² (EN 50125-3:2003, in a switch cabinet 1 m to 3 m from the track)
- Electrical safety
- EN 50124-1:2017
- EN 62368-1:2014 + AC:2015
- EMC emission
- EN 50121-4:2016
- EN 61000-6-4:2007 + A1:2011
- EMC immunity
- EN 50121-4:2016
- EN 61000-6-2:2005
- EMC emission: ECE R10 Rev.5
- EMC immunity: ECE R10 Rev.5
- Operating temperature: 0 °C (EN 60068-2-1:2007, Ae, temperature value in compliance with 6.6 b) to +60 °C (EN 60068-2-2:2007, Be)
- Storage temperature: -40 °C (EN 60068-2-1:2007, Ab) to +85 °C (EN 60068-2-2:2007, Bb)
- Humidity: +55 °C and +25 °C, 90 % to 100 % RH (EN 60068-2-30:2005, Db)
- Electrical safety: EN 62368-1:2014 + AC:2015
- EMC emission
- EN 55032:2015 (multimedia equipment), class A (industrial environments)
- EN 61000-3-2:2014
- EN 61000-3-3:2013
- EMC immunity: EN 55024:2010 + A1:2015 (information technology equipment)
- Linux
- duagon Yocto BSP
- Tested with: duagon Yocto BSP (Kirkstone 4.0, Linux kernel 5.15); Lubuntu 18.04 X LTS
- Windows
- Windows 10 IoT Enterprise 64-bit
- Not all functions are supported











