D013
MVB Interface
Main Features
- Space-saving form factor (48 × 50 x 13 mm)
- Support for MVB devices up to class 4, including bus administrator functionality, process and message data
- Host interface configurable as 8-bit parallel, SPI or serial (UART)
- Compliant with IEC 61375, EN 50121, EN 50155 and EN 61373
- –40 °C to +85 °C operating temperature
Fully Featured MVB Communication Chip
The D013 is a chip-sized MVB controller component on a 48 x 50 x 13 mm footprint, designed for direct integration on a host system PCB. It provides a complete MVB communication solution and fully complies with IEC 61375 and EN 50155. All core elements of the MVB architecture are integrated in a single component, including process and message data, optional bus administrator functionality and EMD and ESD+ physical layer support.
MVB Controller
duagon's own MVB controller is implemented in an FPGA and supports all 4096 process data ports. The host interface is selectable by MODE pin configuration, offering an 8-bit parallel interface for maximum performance, or SPI and serial UART interfaces for simpler connections.
The D013 is available in two configurations: process data only, or process and message data. In the process and message data configuration, a soft CPU runs the optional message data stack directly on the component, minimizing the CPU requirements on the host system. In the process data only configuration, the MVB interface is controlled directly by the host. The optional bus administrator manages the complete MVB network and can be configured using duagon's proprietary network tool.
For Rolling Stock Environments
Designed for harsh rolling stock environments, the D013 meets railway requirements for temperature, humidity, vibration, and EMC. It operates reliably from -40 °C to +85 °C, features conformal coating against humidity, and provides enhanced EMI and vibration robustness in accordance with EN 50155, EN 50121, and EN 61373.
- Capabilities
- Process data
- Optional: Message data
- Optional: Bus administrator
- Physical layer: EMD, ESD+, EMD with pre-emphased signals, as options
- MVB: 1 × board to board
- Host interface options
- 1 × Parallel/Serial, board to board or
- 1 × Parallel/SPI, board to board
- Onboard diagnostic LEDs: system status, initialization, error
- Supply voltage: +3.3 V
- Power consumption: 1.3 W max.
- Dimensions and weight may vary according to selected ordering options.
- Dimensions: (W) 50 mm, (D) 48 mm, (H) 13 mm
- Weight: 20 g
- Part 1: General architecture: IEC 61375-1:2012
- Part 3: Multifunction Vehicle Bus (MVB): IEC 61375-3-1:2012, IEC 61375-3-2:2012
- Operating temperature: -40 °C to +85 °C (EN 50155:2021, class OT6, ST0)
- Rapid temperature variations: EN 50155:2021, class H1, no requirements
- Storage temperature: -40 °C (EN 50155:2021) to +85 °C (EN 60068-2-2, Bb)
- Altitude: +1800 m max. (EN 50125-1:2014, class AX)
- Humidity: 75 % RH max. typ. yearly average, 95 % RH max. for 30 consecutive days/year (EN 60068-2-30)
- Pollution degree: EN 50124-1:2017, class PD2
- Overvoltage category: EN 50124-1:2017, class OV1
- Electrical safety: EN 50124-1:2017
- Fire protection: EN 45545-1:2013, EN 45545-2:2020 and EN 45545-5:2013+A1:2015, HL3
- Protective coatings: EN 50155:2021, class PC2 (Any PCB protected on both sides)
- Programmable component: EN 50155:2021, class M0
- Useful life: 20 years (EN 50155:2021, class L4)