F205
M-Module Carrier Board for 2 Mezzanine Cards
Main Features
- 1 CompactPCI bus slot
- 2 M-Module slots
- -40 °C to +85 °C
- PICMG CompactPCI peripheral card (limited mechanical compliance)
Universal I/O on CompactPCI
The F205 is a 3U M-Module carrier board for universal I/O on the CompactPCI bus. It allows high flexibility in applications such as data acquisition or process control.
The F205 is slightly higher than standard 3U format, providing enough space for two M-Modules while staying compatible with CompactPCI housings through special guide rails already included in the delivery. M-Modules are screwed tightly on the board and require no separately mounted transition panel.
The F205 offers developers instant access to more than 70 different M-Modules for I/O in fields such as process I/O, measurement, instrumentation, motion control, communication, and development.
Long-Term Availability
Long-term availability ensures an extended product life and future-safety.
Related Products
- Two M-Module slots
- Compliant with M-Module standard
- Characteristics: A08, A24, D08, D16, D32, INTA, TRIGI, TRIGO
- Compliance with CompactPCI Specification 2.0 R2.1
- Only one slot required on the 3U CompactPCI bus
- 32-bit/33-MHz PCI-to-M-Module bridge
- FPGA-based
- Compliant with PCI Specification 2.2
- Target on PCI bus
- V(I/O): +3.3 V (+5 V tolerant)
- Supply voltage/power consumption:
- +5 V (-3%/+5%), 20 mA typ.
- +3.3 V (-3%/+5%), 20 mA typ.
- Only M-Modules with a maximum allowed input voltage of 60 V DC are allowed on this board.
- MTBF: 1 046 000 h @ 50 °C (derived from MIL-HDBK-217F)
- Dimensions: 111.7 mm x 160 mm standard
- Front panel: aluminum without handles, cut-outs for front connectors of 2 M-Modules
- Weight: 125 g (without M-Modules)
- Temperature range (operation):
- 0 °C to +60 °C or -40 °C to +85 °C
- Airflow: min. 10 m³/h
- Conduction cooling (on request)
- Temperature range (storage): -40 °C to +85 °C
- Relative humidity (operation): max. 95% non-condensing
- Relative humidity (storage): max. 95% non-condensing
- Altitude: -300 m to +3000 m
- Shock: 15 g, 11 ms
- Bump: 10 g, 16 ms
- Vibration (sinusoidal): 2 g, 10 Hz to 150 Hz
- EN 55032:2015+A11:2020+A1:2020
- EN 55035:2017+A11:2020
- EN 50121-3-2:2016+A1:2019
- EN 301 489-1 V2.2.3
- EN IEC 63000:2018
- Regelung Nr. EMV 06 - Anhang E Ausgabe 2.0 (2019-05-09)
- M-Module drivers for Windows, VxWorks, Linux, QNX as supported
- Basic board driver included in MDIS system package for the respective operating system
















